Telecommunications

Telecommunications Solution

The Telecommunication industry relies on various types of software components for routing and
switching services to provide key communication networking and devices.

KOMEG testing chambers can accurately simulate a variety of conditions the product may be
subjected to during its use in the field for storage or during transportation.

Application Products

The following is for reference only and does not serve as inspection standards for related industries (it is also updated with technology iteration tests)

Application object	Test	Test purposes	Recommended test equipment
PCB board	Cold and hot shock test	Accelerated aging, check whether there is a decrease in output power and abnormal thermal protection	Temperature Shock Test Chamber
Connector	Temperature cycle test High temperature test Constant damp heat test	Check whether the insulation performance is degraded	High and low temperature (damp heat) test chamber High temperature test chamber
Sensor	High temperature test Rapid temperature change test	Accelerated aging Life assessment	High temperature test chamber Rapid temperature change test chamber